Fabless Business
Fabless Business Overview
In the global power semiconductor market, IGBT technology continues to advance, while demand for SiC devices is growing rapidly. Leveraging advanced process technologies, HEB is developing next-generation IGBT, MOSFET, and SiC products.
Wafer Product
Final Product
• Discrete Si : FRD, IGBT, MOSFET • Discrete SiC : SBD, MOSFET • Power Module Packages
Technical Advantage
Technically, we adopt the latest generation of power semiconductor process technologies and, leveraging our team’s decades of turnkey delivery experience, are committed to providing customers with reliable, high-efficiency, and high-quality next-generation power semiconductor products optimized for PPAC (Performance, Power, Area, Cost). At the same time, we achieve exceptional power density and ultra-low power loss that exceed expectations.
End-to-end turnkey solutions from design to sales.
Deep Process Expertise
With over 30 years in the semiconductor industry, we possess deep process development and equipment integration experience, helping customers achieve efficient production.
Fast Customer Response
Our experienced team responds quickly to changing market requirements and provides tailored solutions to meet specific customer needs.
Synergy with Equipment Business
Through close coordination between design and manufacturing, we optimize the entire flow to enhance competitiveness.
Product List - Si
Product List - SiC
